ADIS16505-2SLASHPCBZ datasheet(38/41 Pages) AD

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ADIS16505

Data Sheet

Rev. C | Page 38 of 41

APPLICATIONS INFORMATION

ASSEMBLY AND HANDLING TIPS

Package Attributes

The ADIS16505 is a multichip module package that has a 100-ball

BGA interface. This package has three basic attributes that

influence its handling and assembly to the PCB of the system:

the lid, the substrate, and the BGA pattern. The material of the

lid is a liquid crystal polymer (LCP), and its nominal thickness

is 0.5 mm. The substrate is a laminate that has a nominal thickness

of 1.57 mm. The solder ball material is SAC305, and each ball

has a nominal diameter of 0.75 mm (±0.15 mm). The BGA

pattern is a 10 × 10 array.

All electrical and physical connections are through the 10 × 10

array shown in Figure 62. The bottom view in Figure 66 shows

additional features from the manufacture of the ADIS16505

that are not relevant to the mounting or use of the ADIS16505.

Assembly Tips

When attaching the ADIS16505 to a PCB, follow these guidelines:



The ADIS16505 supports solder reflow attachment processes

in accordance with J-STD-020E.



Limit device exposure to one pass through the solder

reflow process (no rework).



The hole in the top of the lid (see Figure 61) provides venting

and pressure relief during the assembly process of the

ADIS16505. This hole must be kept clear while attaching

the ADIS16505 to a PCB. Although, covering the hole in

normal operation is not typically a problem.

A10

OPENING IN

PACKAGE LID

Figure 61. Pressure Relief Hole



Use no clean flux and avoid exposing the device to

cleaning solvents that can penetrate the inside of the

ADIS16505 through multiple paths.



Manage moisture exposure prior to the solder reflow

processing in accordance with J-STD-033, Moisture

Sensitivity Level 5.



Avoid exposing the ADIS16505 to mechanical shock

survivability that exceeds the maximum rating in Table 3.

In standard PCB processing, high speed handling equipment

and panel separation processes often present the most risk of

introducing harmful levels of mechanical shock survivability.

PCB Layout Suggestions

Figure 62 shows an example of the pad design and layout

for the ADIS16505 on a PCB. This example uses a solder mask

opening with a diameter of 0.73 mm, around a metal pad that

has a diameter of 0.56 mm. When using a material for the system

PCB that has similar thermal expansion properties as the

substrate material of the ADIS16505, the system PCB can also

use the solder mask to define the pads that support attachment

to the balls of the ADIS16505. The coefficient of thermal

expansion (CTE) in the substrate of the ADIS16505 is

approximately 14 ppm/°C.

ALL DIMENSIONS IN MILLIMETERS

1.27

0.73

(MASK OPENING)

0.56

(COPPER PAD)

Figure 62. Recommend PCB Pattern, Solder Mask Defined Pads

Underfill

Underfill can be a useful technique in managing certain threats

to the integrity of the solder joints of the ADIS16505, including

peeling stress and extended exposure to vibration. When selecting

underfill material and developing an application and curing

process, ensure that the material fills the gap between each surface

(the ADIS16505 substrate and system PCB) and adheres to

both surfaces. The ADIS16505 does not require the use of

underfill materials in applications that do not anticipate exposure

to these types of mechanical stresses and when the CTE of the

system PCB is close to the same value as the CTE of the

substrate of the ADIS16505 (~14 ppm/°C).

Process Validation and Control

These guidelines provide a starting point for developing a process

for attaching the ADIS16505 to a system PCB. Because each

system and situation can present unique requirements for this

attachment process, ensure that the process supports optimal

solder joint integrity, verify that the final system meets all

environmental test requirements, and establish observation

and control strategies for all key process attributes (for example,

peak temperatures, dwell times, and ramp rates).

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