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R7FA6T2AB3CFM bảng dữ liệu(PDF) 26 Page - Renesas Technology Corp

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Vr(VCC)
VCC
1 / fr(VCC)
Figure 2.2
Ripple waveform
2.2.7
Thermal Characteristics
Maximum value of junction temperature (Tj) must not exceed the value of section 2.2.1. Tj/Ta Definition.
Tj is calculated by either of the following equations.
● Tj = Ta + θja × Total power consumption
● Tj = Tt + Ψjt × Total power consumption
– Tj : Junction Temperature (°C)
– Ta : Ambient Temperature (°C)
– Tt : Top Center Case Temperature (°C)
– θja : Thermal Resistance of “Junction”-to-“Ambient” (°C/W)
– Ψjt : Thermal Resistance of “Junction”-to-“Top Center Case” (°C/W)
● Total power consumption = Voltage × (Leakage current + Dynamic current)
● Leakage current of IO = Σ (IOL × VOL) /Voltage + Σ (|IOH| × |VCC – VOH|) /Voltage
● Dynamic current of IO = Σ IO (Cin + Cload) × IO switching frequency × Voltage
– Cin: Input capacitance
– Cload: Output capacitance
Regarding θja and Ψjt, see Table 2.11.
Table 2.11
Thermal Resistance
Parameter
Package
Symbol
Value*1
Unit
Test conditions
Thermal Resistance
100-pin LQFP (PLQP0100KB-B)
θja
36
°C/W
JESD 51-2 and 51-7
compliant
64-pin LQFP (PLQP0064KB-C)
39
64-pin QFN (PWQN0064LB-A)
26
48-pin LQFP (PLQP0048KB-B)
60
48-pin QFN (PWQN0048KC-A)
28
100-pin LQFP (PLQP0100KB-B)
Ψjt
0.65
°C/W
JESD 51-2 and 51-7
compliant
64-pin LQFP (PLQP0064KB-C)
0.69
64-pin QFN (PWQN0064LB-A)
0.15
48-pin LQFP (PLQP0048KB-B)
2.01
48-pin QFN (PWQN0048KC-A)
0.17
Note 1. The values are reference values when the 4-layer board is used. Thermal resistance depends on the number of layers or size of the
board. For details, refer to the JEDEC standards.
RA6T2 Datasheet
2. Electrical Characteristics
R01DS0400EJ0150 Rev.1.50
Jul 2, 2025
Page 26 of 101



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