STA333W datasheet(39/42 Pages) STMICROELECTRONICS

39 / 42 page

STA333W

Package information

39/42

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect . The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK specifications are available at: www.st.com.

Figure 16.

PowerSSO36 slug down package information

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

2.15

2.47

0.084

0.097

2.15

2.40

0.084

0.094

0.075

0.003

0.18

0.36

0.007

0.014

0.23

0.32

0.009

0.012

D (1)

10.10

10.50

0.398

0.413

E (1)

7.4

7.6

0.291

0.299

0.5

0.019

8.5

0.335

2.3

0.090

0.10

0.004

0.06

0.002

10.10

10.50

0.398

0.413

0.40

0.016

k5°

5°

0.55

0.90

0.022

0.035

4.3

0.169

10°

1.2

0.047

0.8

0.031

2.9

0.114

T3.65

0.144

1.0

0.039

4.1

4.7

0.161

0.185

6.5

7.3

0.256

0.287

(1) "D” and “E" do not include mold flash or protrusions Mold flash

or protrusions shall not exceed 0.15 mm per side(0.006”)

PowerSSO-36

7587131 A

LEAD COPLANARITY

BOTTOM VIEW

0.1

hx45û

Outline and mechanical data

Exposed pad (or slug) down

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