DCM340C01

2025-03-18

Rev.1.2

16

© 2024-2025

Toshiba Electronic Devices & Storage Corporation

Land Pattern Dimensions for Reference only

16pin SOIC Wide body

( P-SOP16-0811-1.27-002 )

Unit: mm

Figure 14.2 Land Pattern Dimensions for Reference only

Notes.

・

Unless otherwise indicated, dimensions are given in millimeters.

・

This document is a reference drawing in accordance with JEITA ET-7501 Level 3. The Company does not

guarantee the accuracy or completeness of the diagrams and information.

・

The customer should fully evaluate the various conditions (soldering conditions, etc.) and adjust at their

own risk.

・

The diagrams in this document do not accurately show the actual shape and dimensions. Do not use the

dimensions of the actual product as a basis for designing the product.

・

When designing and using the product, check the latest information on the product and the operating

instructions of the equipment in which the product is to be used, and follow these instructions.

Isolation option

Creepage distance: ≥ 8mm

Complies with JEITA ET-7501

Level 3 Normal

Creepage distance: 7.6 mm