ADuM1253

Ultra-Low-Power, I2C Isolator with

Unidirectional SCL, Extended VDD,

Idle-Bus Hot-Swap, and Low VOL

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Analog Devices | 22

A m re accurate estimate f the juncti n temperature can be f un using ΨJT. Measure the device package temperature

(TPACKAGE) in the center of the package using an IR camera or thermocouple and then use the following expression:

TJ = TPACKAGE + ΨJT × PD

Layout Considerations

The PCB designer should follow some critical recommendations to get the best performance from the design.

● Keep the input/output traces as short as possible. To keep signal paths low inductance, avoid using vias.

● Have a solid ground plane underneath the high-speed signal layer.

● Keep the area underneath the ADuM1253 free from ground and signal planes. Any galvanic or metallic connection

between side 1 and side 2 defeats the isolation.