6

TUSB8020B

SLLSEF6C – JULY 2014 – REVISED JUNE 2017

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Copyright © 2014–2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply Voltage Range

VDD Steady-state supply voltage

–0.3

1.4

V

VDD33 Steady-state supply voltage

–0.3

3.8

V

Voltage Range

USB_SSRXP_UP, USB_SSRXN_UP, USB_SSRXP_DN[4:1],

USB_SSRXN_DP[4:1] and USB_VBUS terminals

-0.3

1.4

V

XI terminals

-0.3

2.45

V

All other terminals

-0.3

3.8

V

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

–65

150

°C

V(ESD)

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

–2000

2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)

–500

500

(1)

A 1.05-V, 1.1-V, or 1.2-V supply may be used as long as minimum and maximum supply conditions are met.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD(1)

1.1-V supply voltage

0.99

1.1

1.26

V

VDD33

3.3-V supply voltage

3

3.3

3.6

V

USB_VBUS

Voltage at USB_VBUS PAD

0

1.155

V

TA

Operating free-air temperature range

TUSB8020B

0

25

70

°C

TUSB8020BI

–40

25

85

TJ

Operating junction temperature range

–40

25

105

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

TUSB8020B

UNIT

PHP

48 PINS

RθJA

Junction-to-ambient thermal resistance

31.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

16.1

°C/W

RθJB

Junction-to-board thermal resistance

13

°C/W

ψJT

Junction-to-top characterization parameter

0.5

°C/W

ψJB

Junction-to-board characterization parameter

12.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

0.9

°C/W