www.ti.com

EXAMPLE STENCIL DESIGN

(3.62)

44X (0.5)

48X (1.6)

48X (0.3)

(R0.05) TYP

(8.5)

(8.5)

(3.62)

BASED ON

0.125 THICK

STENCIL

3.06 x 3.06

0.175

3.30 x 3.30

0.150

3.62 x 3.62 (SHOWN)

0.125

4.05 X 4.05

0.1

SOLDER STENCIL

OPENING

STENCIL

THICKNESS

PowerPAD

HTQFP - 1.2 mm max height

PHP0048E

4226616 /A 02/2021

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

12. Board assembly site may have different recommendations for stencil design.

TM

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:8X

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES

BASED ON

0.125 THICK STENCIL

SYMM

SYMM

48

37

13

24

25

36

1

12

BY SOLDER MASK

METAL COVERED

49