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VSC8541XMV-05 bảng dữ liệu(PDF) 96 Page - Microchip Technology

tên linh kiện VSC8541XMV-05
Giải thích chi tiết về linh kiện  Single Port Gigabit Ethernet Copper PHY with GMII/RGMII/MII/RMII Interfaces
PDF  101 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
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VSC8541XMV-05 bảng dữ liệu(HTML) 96 Page - Microchip Technology

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Package Information
VMDS-10513 VSC8541-02 Datasheet Revision 4.1
87
Figure 36 •
Package Drawing
7.2
Thermal Specifications
Thermal specifications for this device are based on the JEDEC JESD51 family of documents. These
documents are available on the JEDEC website at www.jedec.org. The thermal specifications are
modeled using a four-layer test board with two signal layers, a power plane, and a ground plane (2s2p
Terminal Tip
0.80
0.00
5.10
5.10
0.30
0.15
0.85
0.02
0.203 Ref
8.00 BSC
5.20
8.00 BSC
5.20
1.00 Ref
0.40 BSC
0.40
0.20
0.90
0.05
5.30
5.30
0.50
0.25
A
A1
A3
D
D1
E
E1
K
e
L
b
Dimensions and Tolerances
Reference Minimum Nominal
Maximum
2
D
X
Y
Pin 1
corner
68
4×
E
0.10 C
3
e
L
A
A3
A1
0.07 M Z X Y
0.05 M Z
Top View
Bottom View
Side View
Notes
1.
All dimensions and tolerances are in millimeters (mm).
2.
Dimension b applies to the metalliz ed terminal and is
measured between 0.15 mm and 0.30 mm from the
terminal tip.
3.
Maximum package warpage is 0.08 mm.
Detail A
0.08 Z
Z
Pin 1
corner
0.20 R
2
b
2
3
1
L
D1
E1
68
K
Detail A
e



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