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IMX8ULPIEC bảng dữ liệu(PDF) 24 Page - NXP Semiconductors |
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IMX8ULPIEC bảng dữ liệu(HTML) 24 Page - NXP Semiconductors |
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24 / 100 page ![]() Table 5. Analog PMC rise and fall trip point specifications (continued) Rise Fall Fuse setting Min Typ Max Min Typ Max HVD1 1.232 1.252 1.272 1.209 1.229 1.249 HVD2 1.232 1.252 1.272 1.209 1.229 1.249 HVD3 1.232 1.252 1.272 1.209 1.229 1.249 4 System specifications 4.1 Ratings 4.1.1 Thermal handling ratings Symbol Description Min. Max. Unit Notes TSTG Storage temperature -55 150 °C 1 TSDR Solder temperature, lead-free — 260 °C 2 1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life. 2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 4.1.2 Moisture handling ratings Symbol Description Min. Max. Unit Notes MSL Moisture sensitivity level — 3 — 1 1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 4.1.3 ESD handling ratings Symbol Description Min. Max. Unit Notes VHBM Electrostatic discharge voltage, human body model -1000 +1000 V 1 VCDM Electrostatic discharge voltage, charged-device model -250 +250 V 2 1. Determined according to JEDEC Standard JS-001, JOINT JEDEC/ESDA STANDARD FOR ELECTROSTATIC DISCHARGE SENSITIVITY TEST - HUMAN BODY MODEL (HBM) - COMPONENT LEVEL. 2. Determined according to JEDEC Standard JS-002, ESDA/JEDEC JOINT STANDARD FOR ELECTROSTATIC DISCHARGE SENSITIVITY TESTING – CHARGED DEVICE MODEL (CDM) – DEVICE LEVEL. NXP Semiconductors System specifications i.MX 8ULP Applications Processor—Industrial Products, Rev. 1, 09/2023 Data Sheet: Technical Data 24 / 100 |
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