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SPC574S60 bảng dữ liệu(PDF) 41 Page - STMicroelectronics

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DS10601 Rev 6
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SPC574Sx
Electrical characteristics
76
Figure 10. ADC decoupling capacitance/resistance scheme
Note:
All 1.2V pins should be shorted externally on board with minimum resistance and minimum
inductance. It is recommended to use a 1.2V plane on which all 1.2V pins are shorted to
keep resistance and inductance negligible. Recommended capacitors should be placed
very close to the device pins such that parasitic resistance can be reduced. Connection from
VDD_LV pin to capacitor top plate should not exceed more than 5mohm in resistance and
0.5nH in inductance. Similarly connection from bottom plate of capacitor to PCB ground
should not have more than 5mohm resistance and 0.5nH inductance.
DEVICE
VHV_ADC
VREF_ADC
INPUT CHANNEL
VHV_ADC[1:0] VREF_ADC[1:0]
Ce
ADC channel[31:0]
C2
C1
R2
Re
22
32
Table 22. ADC decoupling capacitance/resistance values
Label
Instances
Value
Recommended commercial components
based on PVT/aging degradation
C1
2
470 nF
min 1 µF
R2
2
5 to 8
Ω
max 8
Ω
C2
2
1 µF
min 2.2 µF
Ce
32
≥ 8192(1) × Cs(2) × 2(3) = 115 nF
min 200 nF
Re
32
<= 1/(8192(1) × Fs × Cs(2) × 2(3))=13 Ω
max 10
Ω
1.
Factor depending on the ADC 12 bits
2.
Input capacitance Cs = 7 pF
3.
Factor for 2 ADCs on the same physical channel
Table 23. Package ADC supply decoupling capacitance
PAD
eTQFP100 package
VREFH_ADC_S0
36
VDD_HV_ADC_S0
39
VREFH_ADC_S1
—
VDD_HV_ADC_E0
51



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