SPC572L64F2 datasheet(100/112 Pages) STMICROELECTRONICS

100 / 112 page

Package characteristics

SPC572Lx

100/112

DocID027866 Rev 5

To determine the junction temperature of the device in the application on a prototype board,

use the thermal characterization parameter (

ΨJT) to determine the junction temperature by

measuring the temperature at the top center of the package case using the following

equation:

Equation 4 TJ = TT + (ΨJT x PD)

where:

TT = thermocouple temperature on top of the package (°C)

ΨJT = thermal characterization parameter (°C/W)

PD = power dissipation in the package (W)

The thermal characterization parameter is measured in compliance with the JESD51-2

specification using a 40-gauge type T thermocouple epoxied to the top center of the package

case. Position the thermocouple so that the thermocouple junction rests on the package.

Place a small amount of epoxy on the thermocouple junction and approximately 1 mm of wire

extending from the junction. Place the thermocouple wire flat against the package case to

avoid measurement errors caused by the cooling effects of the thermocouple wire.

When board temperature is perfectly defined below the device, it is possible to use the

thermal characterization parameter (

ΨJPB) to determine the junction temperature by

measuring the temperature at the bottom center of the package case (exposed pad) using

the following equation:

Equation 5 TJ = TB + (ΨJPB x PD)

where:

TT = thermocouple temperature on bottom of the package (°C)

ΨJT = thermal characterization parameter (°C/W)

PD = power dissipation in the package (W)

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