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MPC8560CPX667JC bảng dữ liệu(PDF) 90 Page - NXP Semiconductors

tên linh kiện MPC8560CPX667JC
Giải thích chi tiết về linh kiện  Integrated Processor Hardware Specifications
PDF  108 Pages
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nhà sản xuất  NXP [NXP Semiconductors]
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MPC8560CPX667JC bảng dữ liệu(HTML) 90 Page - NXP Semiconductors

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MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2
90
Freescale Semiconductor
Thermal
The spring mounting should be designed to apply the force only directly above the die. By localizing the
force, rocking of the heat sink is minimized. One suggested mounting method attaches a plastic fence to
the board to provide the structure on which the heat sink spring clips. The plastic fence also provides the
opportunity to minimize the holes in the printed-circuit board and to locate them at the corners of the
package. Figure 56 and Figure 57 provide exploded views of the plastic fence, heat sink, and spring clip.
Figure 56. Exploded Views (1) of a Heat Sink Attachment using a Plastic Force



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