PC7447 datasheet(18/66 Pages) ATMEL

18 / 66 page

PC7457/47 [Preliminary]

5345B–HIREL–02/04

Figure 7. Recommended Thermal Model of PC7447 and PC7457

Power Consumption

Notes:

1. These values apply for all valid processor bus and L3 bus ratios. The values do not

include I/O supply power (OVDD and GVDD) or PLL supply power (AVDD). OVDD and

GVDD power is system dependent, but is typically < 5% of VDD power. Worst case

power consumption for AV

DD < 3 mW

2. Typical power is an average value measured at the nominal recommended VDD (see

Table 3 on page 12) and 65 C while running the Dhrystone 2.1 benchmark and

achieving 2.3 Dhrystone MIPs/MHz.

Bump and Underfill

Die

Substrate

Solder and Air

Die

Substrate

Side View of Model (Not to Scale)

Conductivity

Value

Unit

Bump and Underfill

0.6

W/(m x K)

0.6

Substrate

k18

Solder Ball and Air

0.034

3.8

Table 6. Power Consumption for PC7457

Full-Power Mode

Processor (CPU) Frequency

Unit

600 MHz

1000 MHz

1200 MHz

Core Power Supply

1.1

1.3

Typical(1)(2)

5.3

8.3

15.8

17.5

Maximum(1)(3)

7.9

11.5

22.0

24.2

Nap Mode

Typical(1)(2)

1.3

5.2

Sleep Mode

Typical(1)(2)

1.2

5.1

Deep Sleep Mode (PLL Disabled)

Typical(1)(2)

1.1

5.0

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