STW81200 datasheet(11/58 Pages) STMICROELECTRONICS

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DocID025943 Rev 7

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STW81200

Operating conditions

Table 4. Operating conditions

Symbol

Parameter

Test conditions

Min

Typ

Max

Unit

VCC

Supply voltage pins #14, #17,

#26

2.5

2.7

Supply voltage (LDOs inputs)

pins #9, #18, #28, #36

3.0

5.4

Supply voltage pin #3, #16, #32

2.5

ICC

Current Consumption Pin #3,

#16 and #32 supplied at 4.5 V

DIV2 ON, Main Output only,

4 GHz VCO, max. performance

-84

Current Consumption Pin #3,

#16 and #32 supplied at 2.6 V

-50

Current consumption other

blocks an supplies at 2.6 V

-110

Operating ambient temperature

-40

°C

Maximum junction temperature

125

°C

ΘJA

Junction to ambient package

thermal resistance(1)

Multilayer JEDEC board

°C/W

ΘJB

Junction to board package

thermal resistance(1)

Multilayer JEDEC board

°C/W

ΘJC

Junction to case package

thermal resistance(1)

Multilayer JEDEC board

°C/W

ΨJB

Thermal characterization

parameter junction to board(1)

Multilayer JEDEC board

°C/W

ΨJT

Thermal characterization

parameter junction to top case(1)

Multilayer JEDEC board

0.3

°C/W

1. Refer to JEDEC standard JESD 51-12 for a detailed description of the thermal resistances and thermal parameters. Data

here presented are referring to a Multilayer board according to JEDEC standard.

TJ = TA + ΘJA * Pdiss (in order to estimate TJ if ambient temperature TA and dissipated power Pdiss are known)

TJ = TB + ΨJB * Pdiss (in order to estimate TJ if ambient temperature TB and dissipated power Pdiss are known)

TJ = TT + ΨJT * Pdiss (in order to estimate TJ if ambient temperature TT and dissipated power Pdiss are known)

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