TUSB7320 datasheet(8/117 Pages) TI1

8 / 117 page

TUSB7320, TUSB7340

SLLSE76M – MARCH 2011 – REVISED JULY 2015

www.ti.com

6 Specifications

See the PCIe and USB specifications referred to in Related Documents for the electrical characteristics of those

interfaces.

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VDD33

–0.5

3.6

Supply voltage

VDDA_3P3

–0.5

3.6

VDD11

–0.3

1.4

PCI Express (RX)

1.2

PCI Express REFCLK (single-ended)

–0.5

VDD33 + 0.5

Input voltage

REFCLK (differential)

–0.3

1.15

Miscellaneous 3.3 V IO

–0.5

VDD33 + 0.5

PCI Express (TX)

0.8

1.2

Output voltage

Miscellaneous 3.3 V IO

–0.5

VDD33 + 0.5

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1500

V(ESD)

Electrostatic discharge

Charged-device model (CDM), per JEDEC specification JESD22-

±500

C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD33

3.3

3.6

Supply voltage range

VDDA_3P3

3.3

3.6

VDD11(1)

0.99

1.1

1.21

Operating free-air temperature range

°C

Industrial version

–40

105

Operating junction temperature range

°C

Industrial version

–40

105

(1)

A 1.05-V supply may be used as long as minimum supply conditions are met.

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