TMS570LS3137 datasheet(4/173 Pages) TI1

4 / 173 page

TMS570LS3137

SPNS162C – APRIL 2012 – REVISED APRIL 2015

www.ti.com

The Frequency-Modulated Phase-Locked Loop (FMPLL) clock module is used to multiply the external

frequency reference to a higher frequency for internal use. There are two FMPLL modules on this device.

These modules, when enabled, provide two of the seven possible clock source inputs to the Global Clock

Module (GCM). The GCM manages the mapping between the available clock sources and the device

clock domains.

The device also has an External Clock Prescaler (ECP) module that when enabled, outputs a continuous

external clock on the ECLK pin (or ball). The ECLK frequency is a user-programmable ratio of the

peripheral interface clock (VCLK) frequency. This low-frequency output can be monitored externally as an

indicator of the device operating frequency.

The DMA controller has 16 channels, 32 control packets, and parity protection on its memory. An MPU is

built into the DMA to limit the DMA to prescribed areas of memory and to protect the rest of the memory

system from any malfunction of the DMA.

The Error Signaling Module (ESM) monitors all device errors and determines whether an interrupt is

generated or the external ERROR pin is toggled when a fault is detected. The ERROR pin can be

monitored externally as an indicator of a fault condition in the microcontroller.

The External Memory Interface (EMIF) provides off-chip expansion capability with the ability to interface to

synchronous DRAM (SDRAM) devices, asynchronous memories, peripherals or FPGA devices.

Several interfaces are implemented to enhance the debugging capabilities of application code. In addition

to the built-in ARM Cortex-R4F CoreSight debug features, an External Trace Macrocell (ETM) provides

instruction and data trace of program execution. For instrumentation purposes, a RAM Trace Port (RTP)

module is implemented to support high-speed tracing of RAM and peripheral accesses by the CPU or any

other master. A Data Modification Module (DMM) gives the ability to write external data into the device

memory. Both the RTP and DMM have no or only minimum impact on the program execution time of the

application code. A Parameter Overlay Module (POM) can reroute flash accesses to internal memory or to

the EMIF. This rerouting allows the dynamic calibration against production code of parameters and tables

without rebuilding the code to explicitly access RAM or halting the processor to reprogram the data flash.

With integrated safety features and a wide choice of communication and control peripherals, the

TMS570LS3137 device is an ideal solution for high-performance real-time control applications with safety-

critical requirements.

Device Information(1)

PART NUMBER

PACKAGE

BODY SIZE

TMS570LS3137ZWT

NFBGA (337)

16.0 mm × 16.0 mm

TMS570LS3137PGE

LQFP (144)

20.0 mm × 20.0 mm

(1)

For more information, see Section 9, Mechanical Packaging and Orderable Information.

Device Overview

Submit Documentation Feedback

TMS570LS3137 bảng dữ liệu(PDF) 4 Page - Texas Instruments

TMS570LS3137 bảng dữ liệu(HTML) 4 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

bảng dữ liệu tải về

Link URL