PCM4204PAPR datasheet(28/38 Pages) TI1

28 / 38 page

PCM4204

SBAS327A − JUNE 2004 − REVISED SEPTEMBER 2004

www.ti.com

PowerPAD THERMALLY ENHANCED PACKAGING

The PowerPAD concept is implemented in standard epoxy

resin package material. The integrated circuit is attached

to the leadframe die pad using thermally conductive epoxy.

The package is molded so that the leadframe die pad is

exposed at a surface of the package. This provides an

extremely low thermal resistance to the path between the

IC junction and the exterior case. The external surface of

the leadframe die pad is located on the PCB side of the

package, allowing the die pad to be attached to the PCB

using standard flow soldering techniques. This allows

efficient attachment to the PCB and permits the board

structure to be utilized as a heat sink for the package.

Using a thermal pad identical in size to the die pad and vias

connected to the PCB ground plane, the board designer

can now implement power packaging without additional

thermal hardware (for example, external heat sinks) or the

need for specialized assembly instructions.

Figure 18 illustrates a cross-section view of a PowerPAD

package.

IC Die

Wire Bond

Leadframe Die Pad

Exposed at Base of Package

Die Attach Epoxy

(thermally conductive)

Leadframe

Mold Compount

(Epoxy)

Figure 18. Cross-Section View of a PowerPAD Thermally-Enhanced Package

PCM4204PAPR bảng dữ liệu(PDF) 28 Page - Texas Instruments