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RF430CL330HCPWR bảng dữ liệu(PDF) 39 Page - Texas Instruments

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RF430CL330HCPWR bảng dữ liệu(HTML) 39 Page - Texas Instruments

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RF430CL330H
www.ti.com
SLAS916C – NOVEMBER 2012 – REVISED NOVEMBER 2014
6.4
Trademarks
MSP430, E2E are trademarks of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
All other trademarks are the property of their respective owners.
6.5
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
6.6
Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
7
Mechanical Packaging and Orderable Information
7.1
Packaging Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2012–2014, Texas Instruments Incorporated
Mechanical Packaging and Orderable Information
39
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