RPC56EL60L5BFSR datasheet(86/137 Pages) STMICROELECTRONICS

86 / 137 page

Electrical characteristics

RPC56EL60L5

86/137

DocID026934 Rev 1

3.4

Thermal characteristics

VSS_HV_AD0

VSS_HV_AD1

ADC_0 ground and low reference voltage

ADC_1 ground and low reference voltage

—0

VSS_HV_ADV

SR 3.3 V ADC supply ground

—

VDD_LV_REGCOR

(4)

SR Internal supply voltage

—

VSS_LV_REGCOR

(5)

SR Internal reference voltage

—

VDD_LV_CORx

SR Internal supply voltage

—

VSS_LV_CORx

SR Internal reference voltage

—

VDD_LV_PLL

SR Internal supply voltage

—

VSS_LV_PLL

SR Internal reference voltage

—

SR Ambient temperature under bias

fCPU

 120 MHz

–40

125

°C

SR Junction temperature under bias

—

–40

150

°C

Full functionality cannot be guaranteed when voltage drops below 3.0 V. In particular, ADC electrical characteristics and

I/Os DC electrical specification may not be guaranteed.

VDD_HV_ADR0 and VDD_HV_ADR1 cannot be operated at different voltages, and need to be supplied by the same voltage

source.

VDD_HV_ADRx must always be applied and should be stable before LBIST starts. If this supply is not above its absolute

minimum level, LBIST operations can fail.

Can be connected to emitter of external NPN. Low voltage supplies are not under user control. They are produced by an on-

chip voltage regulator.

For the device to function properly, the low voltage grounds (VSS_LV_xxx) must be shorted to high voltage grounds

(VSS_HV_xxx) and the low voltage supply pins (VDD_LV_xxx) must be connected to the external ballast emitter, if one is used.

Table 9. Recommended operating conditions (3.3 V) (continued)

Symbol

Parameter

Conditions

Min(1)

Max

Unit

Table 10. Thermal characteristics for LQFP144 package(1)

Symbol

Parameter

Conditions

Valu

Unit

RJA

Thermal resistance, junction-to-ambient

natural convection(2)

Single layer board – 1s

°C/

Four layer board – 2s2p

RJMA

Thermal resistance, junction-to-ambient forced

convection at 200 ft/min

Single layer board – 1s

°C/

Four layer board – 2s2p

RJB

Thermal resistance junction-to-board(3)

—24

°C/

RJC

Thermal resistance junction-to-case(4)

—8

°C/



Junction-to-package-top natural convection(5)

—2

°C/

RPC56EL60L5BFSR bảng dữ liệu(PDF) 86 Page - STMicroelectronics

RPC56EL60L5BFSR bảng dữ liệu(HTML) 86 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

bảng dữ liệu tải về

Link URL