PCM3168APAPR datasheet(2/66 Pages) TI1

2 / 66 page

PCM3168A

SBAS452A – SEPTEMBER 2008 – REVISED JANUARY 2016

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Table of Contents

8.14

Timing Requirements: SCL and SDA Control

Features .................................................................. 1

Interface ................................................................... 15

Applications ........................................................... 1

8.15

Typical Characteristics .......................................... 19

Description ............................................................. 1

Detailed Description ............................................ 24

Revision History..................................................... 2

9.1

Overview ................................................................. 24

Description (continued)......................................... 3

9.2

Functional Block Diagram ....................................... 24

Device Comparison Table..................................... 3

9.3

Feature Description................................................. 25

Pin Configuration and Functions ......................... 4

9.4

Device Functional Modes........................................ 31

Specifications......................................................... 7

9.5

8.1

Absolute Maximum Ratings ..................................... 7

Application and Implementation........................ 51

8.2

ESD Ratings.............................................................. 8

10.1

Application Information.......................................... 51

8.3

Recommended Operating Conditions ....................... 8

10.2

Typical Application ................................................ 51

8.4

Thermal Information .................................................. 8

10.3

System Examples ................................................. 53

8.5

Electrical Characteristics........................................... 9

Power Supply Recommendations ..................... 54

8.6

Timing Requirements: System Clock...................... 12

Layout................................................................... 55

8.7

Timing Requirements: Power-On Reset ................. 13

12.1

Layout Guidelines ................................................. 55

8.8

Timing Requirements: Audio Interface for Left-

12.2

Layout Example .................................................... 57

Justified, Right-Justified, and I2S (Slave Mode) ...... 13

Device and Documentation Support ................. 58

8.9

Timing Requirements: Audio Interface for Left-

13.1

Device Support...................................................... 58

Justified, Right-Justified, and I2S (Master Mode) .... 13

13.2

Documentation Support ........................................ 58

8.10

Timing Requirements: Audio Interface for DSP and

TDM (Slave Mode)................................................... 14

13.3

Community Resources.......................................... 58

8.11

Timing Requirements: Audio Interface for DSP and

13.4

Trademarks ........................................................... 58

TDM (Master Mode)................................................. 14

13.5

Electrostatic Discharge Caution ............................ 58

8.12

Timing Requirements: DAC Outputs and ADC

13.6

Glossary ................................................................ 58

Outputs..................................................................... 14

Mechanical, Packaging, and Orderable

8.13

Timing Requirements: Four-Wire Serial Control

Information ........................................................... 58

Interface ................................................................... 15

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Original (September 2008) to Revision A

Page

•

Added ESD Ratings table, Feature Description section, Device Functional Modes section, Application and

Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation

Support section, and Mechanical, Packaging, and Orderable Information section. .............................................................. 1

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