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công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
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công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
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AN4630 bảng dữ liệu(PDF) 17 Page - STMicroelectronics |
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AN4630 bảng dữ liệu(HTML) 17 Page - STMicroelectronics |
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17 / 33 page  AN4630 Design recommendations when using QFN32 package Figure 12: Vias on the exposed pad of the QFN32 package The ground of the two external crystals has to be isolated from the ground of the RF part of the board. This is because the RF ground is “dirty” and this signal can disturb the correct functionality of the two crystals. Also to reduce the coupling effects some cunning have to be taken: In the high-frequency crystal the load capacitor of the FXTAL0, pin 18, has to be connected to ground in series with an inductor (see Figure 13: "High-frequency crystal inductor"); In the low-frequency crystal the ground part of two load capacitors have to be connected together and, after, connected to the ground by an inductor. The two tracks that connect the low-frequency crystal to the SXTAL0 and SXTAL1, pins 23 and 22, have to be put in a layer different from the TOP. DocID027262 Rev 1 17/33 |
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