µPD30500, 30500A, 30500B

29

Data Sheet U12031EJ4V0DS00

4. RECOMMENDED SOLDERING CONDITIONS

Soldering this product under the following soldering conditions is recommended.

For the details of the recommended soldering conditions, refer to Information Document Semiconductor Device

Mounting Technology Manual (C10535E).

For the soldering methods and recommended other than those recommended, consult NEC.

(1) Soldering Conditions of Surface Mount Type

µPD30500S2-150:

272-pin plastic BGA (C/D advanced type) (29

× 29)

µPD30500S2-180:

272-pin plastic BGA (C/D advanced type) (29

× 29)

µPD30500S2-200:

272-pin plastic BGA (C/D advanced type) (29

× 29)

µPD30500AS2-250:

272-pin plastic BGA (C/D advanced type) (29

× 29)

Soldering Method

Soldering Conditions

Recommended

Conditions Symbol

Infrared reflow

Package peak temperature: 235

°C, Time: 30 sec max. (210°C min.),

IR35-103-3

necessary at 125

°C for 10 hours)

VPS

Package peak temperature: 215

°C, Time: 25 to 40 sec max. (200°C min.),

VP15-103-3

necessary at 125

°C for 10 hours)

Partial heating

Pin temperature: 300

°C max., Time: 3 sec max. (per device side)

—

Notes 1. Under development

2. Number of days in storage after the dry pack has been opened. The storage conditions are at 25

°C, 65% RH

MAX.

Caution Do not use two or more soldering methods in combination (except partial heating).

(2) Soldering Conditions of Insertion Type

µPD30500RJ-150: 223-pin ceramic PGA (48 × 48)

µPD30500RJ-180: 223-pin ceramic PGA (48 × 48)

µPD30500RJ-200: 223-pin ceramic PGA (48 × 48)

Soldering Method

Soldering Conditions

Wave soldering

Solder bath temperature: 260

°C max., Time: 10 sec max.

(Pin only)

Partial heating

Pin temperature: 300

°C max., Time: 3 sec max. (per pin)

Caution Wave soldering is only for the lead part in order that jet solder cannot contact with the chip directly.