DAC5687IPZP datasheet(5/79 Pages) TI

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ABSOLUTE MAXIMUM RATINGS

THERMAL CHARACTERISTICS

(1)

DAC5687

SLWS164E – FEBRUARY 2005 – REVISED SEPTEMBER 2006

TERMINAL FUNCTIONS (continued)

TERMINAL

I/O

DESCRIPTION

NAME

NO.

SLEEP

Asynchronous hardware power-down input. Active-High. Internal pulldown.

TXENABLE has two purposes. In all modes, TXENABLE must be high for the DATA to the DAC to

be enabled. When TXENABLE is low, the digital logic section is forced to all 0, and any input data

presented to DA[15:0] and DB[15:0] is ignored. In interleaved data mode, when the qflag register

TXENABLE

bit is cleared, TXENABLE is used to synchronizes the data to channels A and B. The first data

after the rising edge of TXENABLE is treated as A data, while the next data is treated as B data,

and so on.

TESTMODE

TESTMODE is DGND for the user

over operating free-air temperature range (unless otherwise noted)

(1)

UNIT

AVDD(2)

–0.5 V to 4 V

DVDD(3)

–0.5 V to 2.3 V

Supply voltage range

CLKVDD(2)

–0.5 V to 4 V

IOVDD(2)

–0.5 V to 4 V

PLLVDD(2)

–0.5 V to 4 V

Voltage between AGND, DGND, CLKGND, PLLGND, and IOGND

–0.5 V to 0.5 V

AVDD to DVDD

–0.5 V to 2.6 V

DA[15:0](4)

–0.5 V to IOVDD + 0.5 V

DB[15:0](4)

–0.5 V to IOVDD + 0.5 V

SLEEP(4)

–0.5 V to IOVDD + 0.5 V

CLK1/2, CLK1/2C(3)

–0.5 V to CLKVDD + 0.5 V

Supply voltage range

RESETB(4)

–0.5 V to IOVDD + 0.5 V

LPF(4)

–0.5 V to PLLVDD + 0.5 V

IOUT1, IOUT2(2)

–1 V to AVDD + 0.5 V

EXTIO, BIASJ(2)

–0.5 V to AVDD + 0.5 V

EXTLO(2)

–0.5 V to IAVDD + 0.5 V

Peak input current (any input)

20 mA

Peak total input current (all inputs)

30 mA

Operating free-air temperature range (DAC5687I)

–40

°C to 85°C

Tstg

Storage temperature range

–65

°C to 150°C

Lead temperature 1,6 mm (1/16 inch) from the case for 10 seconds

260

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of these or any other conditions beyond those indicated under recommended operating conditions is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Measured with respect to AGND.

(3)

Measured with respect to DGND.

(4)

Measured with respect to IOGND.

over operating free-air temperature range (unless otherwise noted)

Thermal Conductivity

100 HTQFP

UNIT

Junction temperature(2)

105

°C

Theta junction-to-ambient (still air)

19.88

°C/W

Theta junction-to-ambient (150 lfm) (0.762 m/s)

14.37

°C/W

(1)

Air flow or heat sinking reduces

JA and is highly recommended.

(2)

Air flow or heat sinking required for sustained operation at 85

°C and maximum operating conditions to maintain junction temperature.

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