ADSP-21486KSWZ-2AB datasheet(65/68 Pages) AD

65 / 68 page

ADSP-21483/ADSP-21486/ADSP-21487/ADSP-21488/ADSP-21489

Rev. B

Page 65 of 68

March 2013

SURFACE-MOUNT DESIGN

The exposed pad is required to be electrically and thermally

connected to GND. Implement this by soldering the exposed

pad to a GND PCB land that is the same size as the exposed pad.

The GND PCB land should be robustly connected to the GND

plane in the PCB for best electrical and thermal performance.

No separate GND pins are provided in the package.

Figure 53. 176-Lead Low Profile Quad Flat Package, Exposed Pad [LQFP_EP1]

(SW-176-2)

Dimensions shown in millimeters

1 For information relating to the exposed pad on the SW-176-2 package, see the table endnote on Page 60.

COMPLIANT TO JEDEC STANDARDS MS-026-BGA-HD

0.15

0.10

0.05

0.08

COPLANARITY

0.20

0.15

0.09

1.45

1.40

1.35

7°

3.5°

0°

VIEW A

ROTATED 90° CCW

0.27

0.22

0.17

0.75

0.60

0.45

0.50

BSC

LEAD PITCH

24.10

24.00 SQ

23.90

26.20

26.00 SQ

25.80

TOP VIEW

(PINS DOWN)

BOTTOM VIEW

(PINS UP)

EXPOSED

PAD

132

176

133

176

133

PIN 1

1.60 MAX

1.00 REF

SEATING

PLANE

VIEW A

6.00

REF

21.50 REF

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

“SURFACE-MOUNT DESIGN” IN

THIS DATA SHEET.

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