AFS090 datasheet(216/334 Pages) MICROSEMI

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Device Architecture

2- 20 0

R e v isio n 2

Timing Characteristics

Table 2-136 • 3.3 V PCI/PCI-X

Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,

Worst-Case VCCI = 3.0 V

Applicable to Pro I/Os

Speed

Grade

tDOUT

tDP

tDIN

tPY

tPYS

tEOUT

tZL

tZH

tLZ

tHZ

tZLS

tZHS

Units

Std.

0.66

2.81

0.04

1.05

1.67

0.43

2.86

2.00

3.28

3.61

5.09

4.23

–1

0.56

2.39

0.04

0.89

1.42

0.36

2.43

1.70

2.79

3.07

4.33

3.60

–2

0.49

2.09

0.03

0.78

1.25

0.32

2.13

1.49

2.45

2.70

3.80

3.16

Note:

For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on

page 3-9.

Table 2-137 • 3.3 V PCI/PCI-X

Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,

Worst-Case VCCI = 3.0 V

Applicable to Advanced I/Os

Speed

Grade

tDOUT

tDP

tDIN

tPY

tPYS

tEOUT

tZL

tZH

tLZ

tHZ

tZLS

tZHS

Units

Std.

0.66

2.68

0.04

0.86

0.43

2.73

1.95

3.21

3.58

4.97

4.19

0.66

–1

0.56

2.28

0.04

0.73

0.36

2.32

1.66

2.73

3.05

4.22

3.56

0.56

–2

0.49

2.00

0.03

0.65

0.32

2.04

1.46

2.40

2.68

3.71

3.13

0.49

Note:

For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on

page 3-9.

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