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LH28F008SC bảng dữ liệu(PDF) 28 Page - Sharp Corporation |
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LH28F008SC bảng dữ liệu(HTML) 28 Page - Sharp Corporation |
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28 / 38 page ![]() LH28F008SC 8M (1M × 8) Flash Memory 28 AC CHARACTERISTICS - Write Operations1 VCC = 5 V ± 0.5 V, 5 V ± 0.25 V, TA = 0°C to +70°C SYMBOL PARAMETER LH28F008SC-856 LH28F008SC-907 LH28F008SC-1208 UNIT NOTE MIN. MAX. MIN. MAX. MIN. MAX. t AVAV Write Cycle Time 85 90 120 ns t PHWL RP » High Recovery to WE Going Low 1 1 1 µs 2 t ELWL CE » Setup to WE Going Low 10 10 10 ns t WLWH WE Pulse Width 40 40 40 ns t PHHWH RP » V HH Setup to WE Going High 100 100 100 ns 2 t VPWH V PP Setup to WE Going High 100 100 100 ns 2 t AVWH Address Setup to WE Going High 40 40 40 ns 3 t DVWH Data Setup to WE Going High 40 40 40 ns 3 t WHDX Data Hold from WE High 5 5 5 ns t WHAX Address Hold from WE High 5 5 5 ns t WHEH CE » Hold from WE High 10 10 10 ns t WHWL WE Pulse Width High 30 30 30 ns t WHRL WE High to RY »/BY» Going Low 90 90 ns t WHGL Write Recovery before Read 00 0 ns t QVVL V PP Hold from Valid SRD, RY »/BY » High 00 0 ns 2, 4 t QVPH RP » V HH Hold from Valid SRD, RY »/BY » High 00 0 ns 2, 4 NOTES: 1. Read timing characteristics during block erase, byte write and lock-bit configuration operations are the same as during read-only operations. Refer to AC Characteristics for read-only operations. 2. Sampled, not 100% tested. 3. Refer to Command Definitions Table for valid AIN and DIN for block erase, byte write, or lock-bit configuration. 4. VPP should be held at VPPH1/2/3 (and if necessary RP » should be held at VHH) until determination of block erase, byte write, or lock-bit configuration success (SR.1/3/4/5 = 0). 5. See Ordering Information for device speeds (valid operational combinations). 6. See Transient Input/Output Reference Waveform and Transient Equivalent Testing Load Circuit (High Seed Configuration) for testing characteristics. 7. See Transient Input/Output Reference Waveform and Transient Equivalent Testing Load Circuit (Standard Configuration) for testing characters. |
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