IMX28AEC datasheet(1/72 Pages) FREESCALE

tên linh kiện	IMX28AEC

Giải thích chi tiết về linh kiện	Processors Data Sheet for Automotive Products High assurance boot

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Freescale Semiconductor

Data Sheet: Technical Data

Document Number: IMX28AEC

Rev. 1, 04/2011

i.MX28

Package Information

Plastic package

Case 5284 14 x 14 mm, 0.8 mm Pitch

Ordering Information

See Table 1 on page 3 for ordering information.

1

Introduction

The i.MX28 family of processors offers feature

integration suited for automotive infotainment

systems and gateway products. These AEC-Q100

qualified products are designed for cost-optimized

multimedia systems. The i.MX28 enables many of

the features only available in high-end systems, and

at a price point suitable for all vehicles. The core of

the i.MX28 is Freescale’s fast, power-efficient

implementation of the ARM926EJ-S™ core, with

speeds of up to 454 MHz. Integrated power

management, USB PHY, and LCD display

controller all contribute to overall system cost

savings.

The integrated power management unit (PMU) on

the i.MX28 is composed of a triple output DC-DC

switching converter and multiple linear regulators.

These provide power sequencing for the device and

its I/O peripherals such as memories and SD cards,

as well as provide battery charging capability for

Li-Ion batteries.

The i.MX28 processor includes an additional

128-Kbyte on-chip SRAM to make the device ideal

for eliminating external RAM in applications with

small footprint RTOS.

The i.MX28 supports connections to various types

of external memories, such as mobile DDR, DDR2

and LV-DDR2, SLC and MLC NAND Flash.

i.MX28 Applications

Processors Data Sheet for

Automotive Products

Silicon Version 1.2

Contents

1.

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1.

Device Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2.

Ordering Information & Functional Part Differences 3

1.3.

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.1.

Special Signal Considerations . . . . . . . . . . . . . . . 10

3.

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11

3.1.

i.MX28 Device-Level Conditions . . . . . . . . . . . . . . 11

3.2.

Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 18

3.3.

I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 19

3.4.

I/O AC Timing and Parameters . . . . . . . . . . . . . . . 23

3.5.

Module Timing and Electrical Parameters . . . . . . 27

4.

Package Information and Contact Assignments . . . . . . . 59

4.1.

289-Ball MAPBGA—Case 14 x 14 mm,

0.8 mm Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

4.2.

Ground, Power, Sense, and Reference Contact

Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

4.3.

Signal Contact Assignments . . . . . . . . . . . . . . . . . 61

4.4.

i.MX281 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 68

4.5.

i.MX285 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 69

5.

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

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