ISL98608IIH

FN8724 Rev.2.01

Page 5 of 33

Dec 7, 2021

Pin Configuration

ISL98608IIH

(16 BUMP, 4x4 ARRAY, 0.4MM PITCH WLCSP)

TOP VIEW

SDA

LXP

PGND

VBST

AGND

ENN

VIN

ENP

VSUB

VN

A

B

C

D

1

23

VP

1.744 mm

SCL

4

VBSTCP

CP

PGNDCP

CN

Pin Descriptions

PIN NUMBER

PIN NAME

DESCRIPTION

A1

PGND

Power ground for the boost converter.

A2

LXP

Switch node for boost converter. Connect an inductor between the VIN and LXP pins for boost converter

operation.

A3

VBST

Boost Converter Output. The boost converter output supplies the power to the negative charge pump

and LDO. Connect a 4.7µF/0603 or 10µF/0402 capacitor to ground.

A4

VBSTCP

Charge pump input. This pin must be connected to VBST on the PCB, so that the boost regulator

provides the input voltage supply for the charge pump.

B1

AGND

Analog Ground

B2

ENN

VBST and VN enable input. (Note 4)

B3

VP

Positive regulator output. Connect a 4.7µF/0603 or 10µF/0402 capacitor to ground.

B4

CP

Charge pump flying capacitor positive connection. Place a capacitor between CP and CN.

C1

VIN

Input supply voltage. Connect a 4.7µF/0603 or 10µF/0402 bypass capacitor from VIN to ground.

C2

SDA

Serial data connection for I2C Interface. If this pin not used, connect this pin to VIN.

C3

SCL

Serial data connection for I2C Interface. If this pin not used, connect this pin to VIN.

C4

PGNDCP

Power ground for the VN regulator.

D1

ENP

VBST and VP enable input. (Note 4)

D2

VSUB

Substrate connection. VSUB must be the most negative potential on the IC, connect VSUB to VN.

D3

VN

Negative charge pump output. Connect a 4.7µF/0603 or 10µF/0402 capacitor to ground. Connecting

either two 4.7µF/0603 or 10µF/0402 capacitors to ground will lower the negative charge pump

output voltage ripple.

D4

CN

Charge pump flying capacitor negative connection. Place a capacitor between CP and CN.

NOTE:

4. This pin has 1MΩ (typical) pull-down to AGND.