MPC8313E datasheet(74/92 Pages) FREESCALE

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MPC8313E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 1

Freescale Semiconductor

Thermal

20.1

Thermal Characteristics

Table 67 provides the package thermal characteristics for the 516 27

× 27 mm TEPBGAII.

Table 67. Package Thermal Characteristics for TEPBGAII

Characteristic

Board type

Symbol

TEPBGAII

Unit

Notes

Junction to Ambient Natural Convection

Single layer board (1s)

RθJA

°C/W

1,2

Junction to Ambient Natural Convection

Four layer board (2s2p)

RθJA

°C/W

1,2,3

Junction to Ambient (@200 ft/min)

Single layer board (1s)

RθJMA

°C/W

1,3

Junction to Ambient (@200 ft/min)

Four layer board (2s2p)

RθJMA

°C/W

1,3

Junction to Board

—

RθJB

°C/W

Junction to Case

—

RθJC

8°C/W

Junction to Package Top

Natural Convection

7°C/W

Notes:

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.

3. Per JEDEC JESD51-6 with the board horizontal.

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

6. Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written

as Psi-JT.

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