MPC8313E datasheet(56/92 Pages) FREESCALE

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MPC8313E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 1

Freescale Semiconductor

Package and Pin Listings

3. Maximum solder ball diameter measured parallel to datum A.

4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.

5. Package code 5368 is to account for PGE and the built–in heat spreader.

18.3

Pinout Listings

Table 60 provides the pin-out listing for the MPC8313E, TEPBGAII package.

Table 60. MPC8313E TEPBGAII Pinout Listing

Signal

Package Pin Number

Pin Type

Power

Supply

Notes

DDR Memory Controller Interface

MEMC_MDQ[0]

GVDD

—

MEMC_MDQ[1]

GVDD

—

MEMC_MDQ[2]

C10

GVDD

—

MEMC_MDQ[3]

GVDD

—

MEMC_MDQ[4]

GVDD

—

MEMC_MDQ[5]

E11

GVDD

—

MEMC_MDQ[6]

E10

GVDD

—

MEMC_MDQ[7]

GVDD

—

MEMC_MDQ[8]

GVDD

—

MEMC_MDQ[9]

GVDD

—

MEMC_MDQ[10]

GVDD

—

MEMC_MDQ[11]

GVDD

—

MEMC_MDQ[12]

GVDD

—

MEMC_MDQ[13]

GVDD

—

MEMC_MDQ[14]

GVDD

—

MEMC_MDQ[15]

GVDD

—

MEMC_MDQ[16]

A19

GVDD

—

MEMC_MDQ[17]

D18

GVDD

—

MEMC_MDQ[18]

A17

GVDD

—

MEMC_MDQ[19]

E17

GVDD

—

MEMC_MDQ[20]

E16

GVDD

—

MEMC_MDQ[21]

C18

GVDD

—

MEMC_MDQ[22]

D19

GVDD

—

MEMC_MDQ[23]

C19

GVDD

—

MEMC_MDQ[24]

E19

GVDD

—

MEMC_MDQ[25]

A22

GVDD

—

MEMC_MDQ[26]

C21

GVDD

—

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