5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted) (1)

MIN

MAX

UNIT

VDS

Drain-to-Source Voltage

6

V

VGS

Gate-to-Source Voltage

7

V

ID

Drain Current TA = 25°C

1.4

A

ID

Drain Current TA = 85°C

437

mA

IDM

Pulsed Drain Current (tp = 1s)

1.43

A

TJ , TSTG

Operating Junction and Storage Temperature Range

-65

150

°C

IS

Source Current

1.4

A

TL

Lead Temp for Soldering Purpose

260

°C

ESD

Gate-Source / Gate-Drain ESD Rating

2000

V

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

5.2 Thermal Information

THERMAL METRIC(1)

2N7002L

UNIT

DCK

3 PINS

RθJA

Junction-to-ambient thermal resistance

265.4

°C/W

RθJC(top

Junction-to-case (top) thermal resistance

142.3

°C/W

RθJB

Junction-to-board thermal resistance

82.4

°C/W

ΨJT

Junction-to-top characterization parameter

38.2

°C/W

ΨJB

Junction-to-board characterization parameter

81.5

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

2N7002L

SLVSJE8A – DECEMBER 2025 – REVISED FEBRUARY 2026

www.ti.com

4

Submit Document Feedback

Copyright © 2026 Texas Instruments Incorporated

Product Folder Links: 2N7002L