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MPC8309CVMADFC bảng dữ liệu(PDF) 52 Page - NXP Semiconductors

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Giải thích chi tiết về linh kiện  PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications
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MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
52
Freescale Semiconductor
Package and Pin Listings
22 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8309 is available in
a thermally enhanced MAPBGA (mold array process-ball grid array); see Section 22.1, “Package
Parameters for the MPC8309,” and Section 22.2, “Mechanical Dimensions of the MPC8309 MAPBGA,”
for information on the MAPBGA.
22.1
Package Parameters for the MPC8309
The package parameters are as provided in the following list.
Package outline
19 mm
19 mm
Package Type
MAPBGA
Interconnects
489
Pitch
0.80 mm
Module height (typical)
1.48 mm; Min = 1.31mm and Max 1.61mm
Solder Balls
96 Sn / 3.5 Ag / 0.5 Cu (VM package)
Ball diameter (typical)
0.40 mm
22.2
Mechanical Dimensions of the MPC8309 MAPBGA
The following figure shows the mechanical dimensions and bottom surface nomenclature of the
MPC8309, 489-MAPBGA package.



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