TAS5613A

www.ti.com

SLAS711B

– JUNE 2010 – REVISED SEPTEMBER 2011

MODE SELECTION PINS

MODE PINS

OUTPUT

ANALOG

DESCRIPTION

INPUT

CONFIGURATION

M3

M2

M1

0

0

0

Differential

2

× BTL

AD mode

0

0

1

—

—

Reserved

0

1

0

Differential

2

× BTL

BD mode

Differential

(BTL)

0

1

1

1

× BTL + 2 × SE

BTL = BD mode, SE = AD mode

Single Ended

(SE)

1

0

0

Single Ended

4

× SE

AD mode

INPUT_C(1)

INPUT_D(1)

1

0

1

Differential

1

× PBTL

0

0

AD mode

1

0

BD mode

1

1

0

Reserved

1

1

1

(1)

INPUT_C and D are used to select between a subset of AD and BD mode operations in PBTL mode (1=VREG and 0=GND).

PACKAGE HEAT DISSIPATION RATINGS

(1)

PARAMETER

TAS5613APHD

TAS5613ADKD

RθJC (°C/W) – 2 BTL or 4 SE channels

3.2

2.1

RθJC (°C/W) – 1 BTL or 2 SE channel(s)

5.4

3.5

RθJC (°C/W) – 1 SE channel

7.9

5.1

Pad Area (2)

64 mm2

80 mm2

(1)

JC is junction-to-case, CH is case-to-heat sink

(2)

RθH is an important consideration. Assume a 2-mil thickness of typical thermal grease between the pad area and the heat sink and both

channels active. The RθCH with this condition is 1.22°C/W for the PHD package and 1.02°C/W for the DKD package.

Table 1. ORDERING INFORMATION (1)

TA

PACKAGE

DESCRIPTION

TAS5613APHD

64 pin HTQFP

0

°C–70°C

TAS5613ADKD

44 pin PSOP3

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

Copyright

© 2010–2011, Texas Instruments Incorporated

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