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TDA4VM21 bảng dữ liệu(PDF) 170 Page - Texas Instruments

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TDA4VM21 bảng dữ liệu(HTML) 170 Page - Texas Instruments

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6.8 Thermal Resistance Characteristics
This section provides the thermal resistance characteristics used on this device.
For reliability and operability concerns, the maximum junction temperature of the device has to be at or below
the TJ value identified in Section 6.4, Recommended Operating Conditions.
6.8.1 Thermal Resistance Characteristics for ALF Package
It is recommended to perform thermal simulations at the system level with the worst case device power consumption.
NO.
PARAMETER
DESCRIPTION
ALF PACKAGE
°C/W
(1)(3)
AIR FLOW
(m/s)
(2)
T1
RΘJC
Junction-to-case
0.25
N/A
T2
RΘJB
Junction-to-board
2.1
N/A
T3
RΘJA
Junction-to-free air
11.5
0
T4
Junction-to-moving air
7.4
1
T5
6.5
2
T6
6
3
T7
ΨJT
Junction-to-package top
0.1
0
T8
0.1
1
T9
0.1
2
T10
0.1
3
T11
ΨJB
Junction-to-board
1.6
0
T12
1.7
1
T13
1.6
2
T14
1.5
3
(1)
These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on
a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
•
JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
•
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
•
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-9, Test Boards for Area Array Surface Mount Packages
(2)
m/s = meters per second.
(3)
°C/W = degrees Celsius per watt.
TDA4VM-Q1, TDA4VM
SPRSP36K – SEPTEMBER 2021 – REVISED APRIL 2024
www.ti.com
170
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Copyright © 2024 Texas Instruments Incorporated
Product Folder Links: TDA4VM-Q1 TDA4VM



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