S32K310 datasheet(84/136 Pages) NXP

84 / 136 page

Table 42. Fast External Oscillator (FXOSC) (continued)

Symbol

Description

Min

Typ

Max

Unit

Condition

Spec

Number

TFXOSC

Fxosc start up

time (ALC enabled) 2

—

IFXOSC

Oscillator Analog

circuit supply

current, V25 supply

(ALC enable)

—

using 8, 16 or 40 MHz

crystal

—

IFXOSC

Oscillator Analog

circuit supply

current, V25 supply

(ALC disabled)

—

2.7

using 8, 16 or 40 MHz

crystal

—

EXTAL_SWING_

Peak-to-peak

voltage swing on

EXTAL pin in crystal

oscillator mode (ALC

enabled)

0.3

—

1.4

—

EXTAL_SWING_

Peak-to-peak

voltage swing on

EXTAL pin in crystal

oscillator mode (ALC

disabled) 3

1.2

—

2.75

—

CLKIN_VIL_

EXTAL_BYPASS

Input clock low level

in bypass mode

—

vref-0.5

vref=0.5*VDD_HV_A

—

CLKIN_VIH_

EXTAL_BYPASS

Input clock high level

in bypass mode

vref+0.5

—

VDD_HV

vref=0.5*VDD_HV_A

—

VSB

Self Bias Voltage

350

—

850

—

Amplifier

Transconductance

9.7

—

18.5

mA/V

GM_SEL[3:0] =

4`b1111

—

1. For bypass mode applications, the EXTAL pin should be driven low when FXOSC is in off/disabled state.

2. The startup time specification is valid only when the recommended crystal and load capacitors are used. For higher load

capacitances, the actual startup time might be higher.

3. The recommended gm setting to ensure extal swing < 2.75V at 8MHz in ALC-disabled mode is gm=4'b0010.

Recommended gm settings in ALC-disabled mode for all other supported frequencies and crystals remain the same.

To ensure stable oscillations, FXOSC incorporates the feedback resistance internally.

Drive level is a crystal specification and if crystal load capacitance is increased beyond the recommended value, it may violate

the crystal drive level rating. In such cases, contact NXP sales representative for selecting the correct crystal.

NXP Semiconductors

Clocking modules

S32K3xx Data Sheet, Rev. 8, 06/2023

Data Sheet: Technical Data

Preliminary Information for S32K3x8

84 / 136

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