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STA350B bảng dữ liệu(PDF) 86 Page - STMicroelectronics

tên linh kiện STA350B
Giải thích chi tiết về linh kiện  2.1-channel high-efficiency digital audio system Sound TerminalR
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
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STA350B bảng dữ liệu(HTML) 86 Page - STMicroelectronics

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PowerSSO-36 slug-down package thermal characteristics (STA350BW)
STA350B, STA350BW
86/94
DocID018572 Rev 7
9
PowerSSO-36 slug-down package thermal
characteristics (STA350BW)
Using a four-layer PCB the thermal resistance junction-to-ambient with 2 copper ground
areas of 6 x 4 cm2 and with 24 via holes (see Figure 36) is 17 °C/W in natural air
convection.
The dissipated power within the device depends primarily on the supply voltage, load
impedance and output modulation level.
Thus, the maximum estimated dissipated power for the STA350BW is:
Figure 36. Double-layer PCB with 2 copper ground areas and 24 via holes
Figure 37 shows the power derating curve for the PowerSSO-36 slug-down package on
PCBs with copper areas of 5 x 4 cm2 and 6 x 4 cm2.
Figure 37. PowerSSO-36 power derating curve
2 x 40 W @ 8 Ω, 25.5 V
Pd max ~ 8 W
2 x 17 W + 1 x 35 W @ 4 Ω, 8 Ω, 25 V
Pd max < 7 W
AM045200v1
0
1
2
3
4
5
6
7
8
0
20
40
60
80
100
120
140
160
Pd (W)
Tamb ( °C)
Copper Area 5x4 cm
and 20 via holes
STA350BW
Power-SSO36
Copper Area 6x4 cm
and 24 via holes
Copper Area 5x4 cm
and 20 via holes
STA350BW
Power-SSO36
Copper Area 6x4 cm
and 24 via holes
AM045201v1



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