FS32K112BHTXMLLTR datasheet(90/100 Pages) NXP

90 / 100 page

To determine the junction temperature of the device in the application when heat sinks

are not used, the Thermal Characterization Parameter (

ΨJT) can be used to determine the

junction temperature with a measurement of the temperature at the top center of the

package case using this equation:

where:

• TT = thermocouple temperature on top of the package (°C)

•

ΨJT = thermal characterization parameter (°C/W)

• PD = power dissipation in the package (W)

The thermal characterization parameter is measured per JESD51-2 specification using a

40 gauge type T thermocouple epoxied to the top center of the package case. The

thermocouple should be positioned so that the thermocouple junction rests on the

package. A small amount of epoxy is placed over the thermocouple junction and over

about 1 mm of wire extending from the junction. The thermocouple wire is placed flat

against the package case to avoid measurement errors caused by cooling effects of the

thermocouple wire.

Dimensions

8.1 Obtaining package dimensions

Package dimensions are provided in the package drawings.

To find a package drawing, go to http://www.nxp.com and perform a keyword search for

the drawing’s document number:

Package option

Document Number

32-pin QFN

SOT617-3 1

48-pin LQFP

98ASH00962A

64-pin LQFP

98ASS23234W

100-pin LQFP

98ASS23308W

100-pin MAPBGA

98ASA00802D

144-pin LQFP

98ASS23177W

176-pin LQFP

98ASS23479W

1. 5x5 mm package

Dimensions

S32K1xx Data Sheet, Rev. 12, 02/2020

NXP Semiconductors

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