ASP00886IRGCR datasheet(2/139 Pages) TI

2 / 139 page

3 Description

The Texas Instruments MSP430F55xx microcontrollers (MCUs) are part of the MSP430™ system control &

communication family of ultra-low-power microcontrollers consists of several devices featuring peripheral sets

targeted for a variety of applications. The architecture, combined with extensive low-power modes, is optimized

to achieve extended battery life in portable measurement applications. The microcontroller features a powerful

16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The

digitally controlled oscillator (DCO) allows the devices to wake up from low-power modes to active mode in 3.5

µs (typical).

The MSP430F5529, MSP430F5527, MSP430F5525, and MSP430F5521 microcontrollers have integrated USB

and PHY supporting USB 2.0, four 16-bit timers, a high-performance 12-bit analog-to-digital converter (ADC),

two USCIs, a hardware multiplier, DMA, an RTC module with alarm capabilities, and 63 I/O pins. The

MSP430F5528, MSP430F5526, MSP430F5524, and MSP430F5522 microcontrollers include all of these

peripherals but have 47 I/O pins.

The MSP430F5519, MSP430F5517, and MSP430F5515 microcontrollers have integrated USB and PHY

supporting USB 2.0, four 16-bit timers, two USCIs, a hardware multiplier, DMA, an RTC module with alarm

capabilities, and 63 I/O pins. The MSP430F5514 and MSP430FF5513 microcontrollers include all of these

peripherals but have 47 I/O pins.

Typical applications include analog and digital sensor systems, data loggers, and others that require connectivity

to various USB hosts.

The MSP430F55xx MCUs are supported by an extensive hardware and software ecosystem with reference

designs and code examples to get your design started quickly. Development kits include the MSP430F5529 USB

LaunchPad™ development kit and the MSP430F5529 experimenter’s board as well as the MSP-

TS430PN80USB 80-pin target development board and the MSP-TS430RGC64USB 64-pin target development

board. TI also provides free MSP430Ware™ software, which is available as a component of Code Composer

Studio™ IDE desktop and cloud versions within TI Resource Explorer. The MSP430 MCUs are also supported by

extensive online collateral, training, and online support through the TI E2E™ support forum.

For complete module descriptions, see the MSP430F5xx and MSP430F6xx Family User's Guide.

Device Information

PART NUMBER(1)

PACKAGE

BODY SIZE(2)

MSP430F5529IPN

LQFP (80)

12 mm × 12 mm

MSP430F5528IRGC

VQFN (64)

9 mm × 9 mm

MSP430F5528IYFF

DSBGA (64)

See Section 11

MSP430F5528IZXH

nFBGA (80)

5 mm × 5 mm

MSP430F5528IZQE(3)

MicroStar Junior™ BGA (80)

5 mm × 5 mm

(1)

For the most current part, package, and ordering information for all available devices, see the

Package Option Addendum in Section 11, or see the TI website at www.ti.com.

(2)

The sizes shown here are approximations. For the package dimensions with tolerances, see the

Mechanical Data in Section 11.

(3)

All orderable part numbers in the ZQE (MicroStar Junior BGA) package have been changed to a

status of Last Time Buy. Visit the Product life cycle page for details on this status.

MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526, MSP430F5525, MSP430F5524,

MSP430F5522, MSP430F5521, MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514,

MSP430F5513

SLAS590P – MARCH 2009 – REVISED SEPTEMBER 2020

www.ti.com

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Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525

MSP430F5524 MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514

MSP430F5513

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