LC823450 datasheet(111/112 Pages) ONSEMI

tên linh kiện	LC823450

Giải thích chi tiết về linh kiện	Low Power & High-Resolution Audio Processing System LSI

PDF	112 Pages

Scroll/Zoom	100%

nhà sản xuất	ONSEMI [ON Semiconductor]

Trang chủ	http://www.onsemi.com

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111 / 112 page

LC823450

www.onsemi.com

111

PACKAGE DIMENSIONS

LFBGA240, 11x11

CASE 566EY

ISSUE O

SEATING

PLANE

0.10 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b IS MEASURED AT THE MAXIMUM

SOLDER BALL DIAMETER PARALLEL TO DATUM C.

4. COPLANARITY APPLIES TO SPHERICAL CROWNS

OF SOLDER BALLS.

5. DATUM C, THE SEATING PLANE, IS DEFINED BY

THE SPHERICAL CROWNS OF SOLDER BALLS.

DIM

MIN

MAX

−−−

MILLIMETERS

11.00 BSC

0.30

0.40

0.65 BSC

1.31

A B

PIN A1

INDICATOR

e/2

0.10 C

240X

0.10 C

0.20

0.30

11.00 BSC

0.35

240X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.65

0.10 C

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 4

RECOMMENDED

PACKAGE

OUTLINE

12 3

PITCH

910

67 8

NOTE 5

0.15

0.08

0.70 REF

0.26 REF

NOTE 3

15 16

12 1314

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