AT40K datasheet(59/67 Pages) ATMEL

59 / 67 page

AT40K/AT40KLV Series FPGA

0896C–FPGA–04/02

100T1 – TQFP

2325 Orchard Parkway

San Jose, CA 95131

TITLE

DRAWING NO.

REV.

100T1

11/30/01

Bottom View

Side View

Top View

Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,

datums, etc.

2. The top package body size may be smaller than the bottom package size by as much as 0.15 mm.

3. Dimensions D1 and E1 do not include mold protrusions. Allowable protrusion is 0.25 mm per side. D1 and E1 are maximum plastic

body size dimensions, including mold mismatch.

4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall not cause the lead width to exceed the maximum

b dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum space between protrusion and

an adjacent lead is 0.07 mm for 0.4 and 0.5 mm pitch packages.

5. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.

6. A1 is defined as the distance from the seating place to the lowest point on the package body.

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

NOM

MAX

NOTE

100T1, 100-lead (14 x 14 x 1.0 mm Body), Thin Plastic

Quad Flat Pack (TQFP)

0.05

0.15

0.95

1.00

1.05

16.00 BSC

14.00 BSC

2, 3

16.00 BSC

14.00 BSC

2, 3

0.50 BSC

0.17

0.22

0.27

4, 5

1.00 REF

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