ADC31RF80IRMP datasheet(5/136 Pages) TI1

5 / 136 page

ADC31RF80

www.ti.com

SBAS860 – AUGUST 2017

Product Folder Links: ADC31RF80

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage range

AVDD19

–0.3

2.1

AVDD

–0.3

1.4

DVDD

–0.3

1.4

Voltage applied to input pins

INP, INM

–0.3

AVDD19 + 0.3

CLKINP, CLKINM

–0.3

AVDD + 0.6

SYSREFP, SYSREFM, SYNCBP, SYNCBM

–0.3

AVDD + 0.6

SCLK, SEN, SDIN, RESET, PDN, GPIO1, GPIO2,

GPIO3, GPIO4

–0.2

AVDD19 + 0.2

Voltage applied to output pins

–0.3

2.2

Temperature

Operating free-air, TA

–40

°C

Storage, Tstg

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±500

(1)

Always power up the DVDD supply (1.15 V) before the AVDD19 (1.9 V) supply. The AVDD (1.15 V) supply can come up in any order.

(2)

Prolonged use above this junction temperature may increase the device failure-in-time (FIT) rate.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage(1)

AVDD19

1.8

1.9

2.0

AVDD

1.1

1.15

1.25

DVDD

1.1

1.15

1.2

Temperature

Operating free-air, TA

–40

°C

Operating junction, TJ

105(2)

125

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

ADC31RF80

UNIT

RMP (VQFN)

72 PINS

RθJA

Junction-to-ambient thermal resistance

21.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

4.4

°C/W

RθJB

Junction-to-board thermal resistance

2.0

°C/W

ψJT

Junction-to-top characterization parameter

0.1

°C/W

ψJB

Junction-to-board characterization parameter

2.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

0.2

°C/W

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