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STM32F101XF bảng dữ liệu(PDF) 44 Page - STMicroelectronics

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STM32F101XF bảng dữ liệu(HTML) 44 Page - STMicroelectronics

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Electrical characteristics
STM32F101xF, STM32F101xG
44/117
DocID16553 Rev 5
Table 16. Maximum current consumption in Sleep mode, code running from Flash or
RAM
Symbol
Parameter
Conditions
fHCLK
Max(1)
1. Guaranteed by characterization results, tested in production at VDD max, fHCLK max with peripherals
enabled.
Unit
TA = 85 °C
IDD
Supply current in
Sleep mode
External clock(2) all
peripherals enabled
2. External clock is 8 MHz and PLL is on when fHCLK > 8 MHz.
36 MHz
27.5
mA
24 MHz
20
16 MHz
15
8 MHz
9
External clock(2), all
peripherals disabled
36 MHz
6.9
24 MHz
5.9
16 MHz
5.4
8 MHz
4.7
Table 17. Typical and maximum current consumptions in Stop and Standby modes
Symbol
Parameter
Conditions
Typ(1)
Max
Unit
VDD/
VBAT =
2.0 V
VDD/
VBAT =
2.4 V
VDD/VBA
T
= 3.3 V
TA =
85 °C
IDD
Supply current
in Stop mode
Regulator in Run mode,
Low-speed and high-speed internal RC
oscillators and high-speed oscillator
OFF (no independent watchdog)
-
34.5
35
379
µA
Regulator in Low-power mode,
Low-speed and high-speed internal RC
oscillators and high-speed oscillator
OFF (no independent watchdog)
-
24.5
25
365
Supply current
in Standby
mode
Low-speed internal RC oscillator and
independent watchdog ON
-3
3.8
-
Low-speed internal RC oscillator ON,
independent watchdog OFF
-2.8
3.6
-
Low-speed internal RC oscillator and
independent watchdog OFF, low-speed
oscillator and RTC OFF
-1.9
2.1
5(2)
IDD_VBAT
Backup domain
supply current
Low-speed oscillator and RTC ON
1.05
1.1
1.4
2(2)
1. Typical values are measured at TA = 25 °C.
2. Guaranteed by characterization results.



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