DM8147SCIS0 datasheet(7/377 Pages) TI1

7 / 377 page

TMS320DM8148, TMS320DM8147

www.ti.com

SPRS647E – MARCH 2011 – REVISED DECEMBER 2013

High-Performance System-on-Chip (SoC)

......... 1

7.2

Power

.............................................. 181

1.1

Features

............................................. 1

7.3

Reset

.............................................. 189

1.2

Applications

.......................................... 3

7.4

Clocking

........................................... 197

1.3

Description

........................................... 4

7.5

Interrupts

.......................................... 214

1.4

Functional Block Diagram

........................... 6

Peripheral Information and Timings

............. 221

Revision History

.............................................. 8

8.1

Parameter Information

............................ 221

8.2

Recommended Clock and Control Signal Transition

Device Overview

....................................... 12

Behavior

........................................... 222

2.1

Device Comparison

................................ 12

8.3

Controller Area Network Interface (DCAN)

....... 223

2.2

Device Characteristics

.............................. 12

8.4

EDMA

............................................. 225

2.3

Device Compatibility

................................ 14

8.5

Emulation Features and Capability

............... 232

2.4

ARM® Cortex™-A8 Microprocessor Unit (MPU)

Subsystem Overview

............................... 14

8.6

Ethernet MAC Switch (EMAC SW)

................ 236

2.5

C674x™ DSP Overview

............................ 16

8.7

General-Purpose Input/Output (GPIO)

............ 251

8.8

General-Purpose Memory Controller (GPMC) and

2.6

System Memory Management Unit (MMU)

........ 20

Error Location Module (ELM)

..................... 254

2.7

Media Controller Overview

......................... 21

8.9

High-Definition Multimedia Interface (HDMI)

...... 271

2.8

HDVICP2 Overview

................................ 21

8.10

High-Definition Video Processing Subsystem

2.9

SGX530 Overview

.................................. 22

(HDVPSS)

......................................... 274

2.10

Spinlock Module Overview

......................... 22

8.11

Inter-Integrated Circuit (I2C)

...................... 280

2.11

Mailbox Module Overview

.......................... 23

8.12

Imaging Subsystem (ISS)

......................... 284

2.12

Memory Map Summary

............................. 24

8.13

DDR2/DDR3 Memory Controller

.................. 287

Device Pins

............................................. 34

8.14

Multichannel Audio Serial Port (McASP)

.......... 324

3.1

Pin Maps

........................................... 34

8.15

Multichannel Buffered Serial Port (McBSP)

....... 332

3.2

Terminal Functions

................................. 43

8.16

MultiMedia Card/Secure Digital/Secure Digital Input

Device Configurations

.............................. 153

Output (MMC/SD/SDIO)

........................... 337

4.1

Control Module Registers

......................... 153

8.17

Peripheral Component Interconnect Express (PCIe)

..................................................... 340

4.2

Boot Modes

....................................... 153

8.18

Serial ATA Controller (SATA)

..................... 347

4.3

Pin Multiplexing Control

........................... 159

8.19

Serial Peripheral Interface (SPI)

.................. 351

4.4

Handling Unused Pins

............................ 170

8.20

Timers

............................................. 358

4.5

DeBugging Considerations

........................ 170

8.21

Universal Asynchronous Receiver/Transmitter

System Interconnect

................................ 172

(UART)

............................................ 360

Device Operating Conditions

...................... 176

8.22

Universal Serial Bus (USB2.0)

.................... 362

6.1

Absolute Maximum Ratings

....................... 176

Device and Documentation Support

............. 370

6.2

Recommended Operating Conditions

............. 177

9.1

Device Support

.................................... 370

6.3

Power-On Hours (POH)

........................... 178

9.2

Documentation Support

........................... 371

6.4

Electrical Characteristics Over Recommended

9.3

Community Resources

............................ 371

Ranges of Supply Voltage and Operating

Temperature (Unless Otherwise Noted)

.......... 179

Mechanical

............................................ 372

Power, Reset, Clocking, and Interrupts

......... 181

10.1

Thermal Data for CYE-04 (Top Hat)

.............. 372

7.1

Power, Reset and Clock Management (PRCM)

10.2

Packaging Information

............................ 372

Module

............................................ 181

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