MLX90616ESF-HCA

Infra Red Thermometer in TO-39

for high temperature thermometer guns

3901090616

Page 3 of 36

Data Sheet

Rev 002

August 20, 2012

3 Table of Contents

1 Functional diagram ................................................................................................................................................................................ 1

2 General Description ............................................................................................................................................................................... 1

General description (continued) ................................................................................................................................................................ 2

3 Table of Contents .................................................................................................................................................................................. 3

4 Glossary of Terms ................................................................................................................................................................................. 4

5 Maximum ratings ................................................................................................................................................................................... 4

6 Pin definitions and descriptions.............................................................................................................................................................. 5

7 Electrical Specifications ......................................................................................................................................................................... 6

8 Detailed description ............................................................................................................................................................................... 8

8.1 Block diagram ................................................................................................................................................................................ 8

8.2 Signal processing principle ............................................................................................................................................................. 8

8.3 Block description ............................................................................................................................................................................ 8

8.3.1 Amplifier.................................................................................................................................................................................. 8

8.3.2 Supply regulator and POR ...................................................................................................................................................... 9

8.3.3 EEPROM ................................................................................................................................................................................ 9

8.3.4 On-chip filtering and settling time: ......................................................................................................................................... 12

8.3.5 RAM...................................................................................................................................................................................... 13

8.4 SMBus compatible 2-wire protocol ............................................................................................................................................... 13

8.4.1 Functional description ........................................................................................................................................................... 13

8.4.2 Differences with the standard SMBus specification (reference [1]) ........................................................................................ 14

8.4.3 Detailed description............................................................................................................................................................... 14

8.4.4 AC specification for SMBus................................................................................................................................................... 16

8.4.5 Bit transfer ............................................................................................................................................................................ 17

8.4.6 Commands ........................................................................................................................................................................... 17

8.4.7 Sleep Mode........................................................................................................................................................................... 18

8.4.8 MLX90616 SMBus specific remarks...................................................................................................................................... 19

8.5 PWM ............................................................................................................................................................................................ 20

8.5.1 Single PWM format ............................................................................................................................................................... 21

8.5.2 Customizing the temperature range for PWM output ............................................................................................................. 22

8.6 Switching Between PWM and SMBus communication.................................................................................................................. 23

8.6.1 PWM is enabled.................................................................................................................................................................... 23

8.6.2 Request condition ................................................................................................................................................................. 23

8.6.3 PWM is disabled ................................................................................................................................................................... 23

8.7 Computation of ambient and object temperatures......................................................................................................................... 24

8.7.1 Ambient temperature Ta ....................................................................................................................................................... 24

8.7.2 Object temperature To .......................................................................................................................................................... 24

8.7.3 Calculation flow..................................................................................................................................................................... 24

8.8 Thermal relay ............................................................................................................................................................................... 25

9 Unique Features .................................................................................................................................................................................. 26

10 Performance Graphs ......................................................................................................................................................................... 26

10.1 Temperature accuracy of the MLX90616 .................................................................................................................................... 26

10.1.1 Ambient temperature accuracy............................................................................................................................................ 26

10.1.2 Object temperature accuracy, using the internal temperature calculation algorithm ............................................................. 26

10.1.3 Object temperature accuracy, with external calculation ....................................................................................................... 26

10.2 Sensitivity ................................................................................................................................................................................... 26

10.3 Noise.......................................................................................................................................................................................... 27

10.4 Sensing element size ................................................................................................................................................................. 27

10.5 Field Of View (FOV) without external optics................................................................................................................................ 27

10.6 Spectral Filter ............................................................................................................................................................................. 28

11 Applications Information..................................................................................................................................................................... 29

11.1 Use of the MLX90616 thermometer in SMBus configuration ....................................................................................................... 29

11.2 Use of multiple MLX90616s in SMBus configuration................................................................................................................... 29

11.3 PWM output operation................................................................................................................................................................ 30

11.4 Thermal alert / thermostat........................................................................................................................................................... 31

12 Application Comments ....................................................................................................................................................................... 31

13 Standard information regarding manufacturability of Melexis products with different soldering processes .......................................... 33

14 ESD Precautions ............................................................................................................................................................................... 33

15 FAQ................................................................................................................................................................................................... 33

16 Package Information.......................................................................................................................................................................... 35

16.1 Part marking............................................................................................................................................................................... 35

17 References ........................................................................................................................................................................................ 36

18 Disclaimer.......................................................................................................................................................................................... 36