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công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
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TPS80032A2ABYFFR bảng dữ liệu(PDF) 13 Page - Texas Instruments |
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TPS80032A2ABYFFR bảng dữ liệu(HTML) 13 Page - Texas Instruments |
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13 / 127 page  TPS80032 www.ti.com SWCS059I – MARCH 2011 – REVISED NOVEMBER 2014 Recommended Operating Conditions (continued) Over operating free-air temperature range (unless otherwise noted) PARAMETER MIN NOM MAX UNIT Battery charger supply voltage VAC 0 5.0 10.0 V Battery charger CHRG_PMID 0 5.0 6.0 V Battery charger CHRG_SW and CHRG_BOOT 0 5.0 6.0 V Battery charger CHRG_VREF 0 5.0 6.5 V Battery charger CHRG_DET_N 0 LDOUSB 4.8 V All other charger analog-related input balls such as CHRG_CSIN, 0 3.8 4.8 V CHRG_CSOUT, and CHRG_LED_IN Voltage on the USB OTG ID ball 0 LDOUSB LDOUSBmax V Voltage on the VRTC GPADC balls GPADC_IN0, GPADC_IN1, and VRTC VRTCmax V GPADC_IN4 Voltage on the VANA GPADC balls GPADC_IN2, GPADC_IN3, VANA VANAmax V GPADC_IN5, and GPADC_IN6 Voltage on the crystal oscillator OSC32KIN ball VRTC VRTCmax V Voltage on all other analog input balls such as GGAUGE_RESN and VANA VANAmax V GGAUGE_RESP OTP memory supply voltage VPROG 8.0 10.0 V Voltage on VRTC digital input balls VRTC VRTCmax V Voltage on VIO digital input balls VIO VIOmax V Voltage on VBAT digital input balls 0 3.8 4.8 V Ambient temperature range –40 27 85 °C Junction temperature (TJ) –40 27 125 °C Storage temperature range –65 27 150 °C Lead temperature (soldering, 10 seconds) 260 °C 4.4 Thermal Characteristics for YFF Package NAME DESCRIPTION (°C/W)(1) AIR FLOW (m/s)(2) R ΘJC Junction-to-case (top) 0.1 0.00 R ΘJB Junction-to-board 19.0 0.00 R ΘJA Junction-to-free air 37.7 0.00 PsiJT Junction-to-package top 0.7 0.00 PsiJB Junction-to-board 18.6 0.00 (1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [R ΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements The maximum power, 0.4 W, is at 85°C ambient temperature. (2) m/s = meters per second Copyright © 2011–2014, Texas Instruments Incorporated Specifications 13 Submit Documentation Feedback Product Folder Links: TPS80032 |
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