TLV320DAC32 datasheet(2/70 Pages) TI1

2 / 70 page

DESCRIPTION

SIMPLIFIED BLOCK DIAGRAM

HPR+

HPL-/HPLCOM

HPL+

LINEL

DAC

DACR

I2CControl

Bus

AudioClock

Generation

Bias/

Reference

VolumeCtl

&Effects

VolumeCtl

&Effects

LINER

VCM

HPR-/HPRCOM/

SPKFC

VCM

AudioSerial

Bus

Voltage

Supplies

LDO

DigitalCore

TLV320DAC32

SLAS506B – NOVEMBER 2006 – REVISED DECEMBER 2008........................................................................................................................................ www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

The device is available in a 5 x 5mm 32-lead QFN package.

PACKAGING/ORDERING INFORMATION(1)

PACKAGE

OPERATING

ORDERING

TRANSPORT

PRODUCT

PACKAGE

DESIGNATOR

TEMPERATURE

NUMBER

MEDIA, QUANTITY

RANGE

TLV320DAC32IRHBT

Tape and Reel, 250

TLV320DAC32

QFN-32

RHB

–40C to 85C

TLV320DAC32IRHBR

Tape and Reel, 3000

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

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