TLK1201ARCP_16 datasheet(10/24 Pages) TI1

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ABSOLUTE MAXIMUM RATINGS

(1)

DISSIPATION RATING TABLE

TLK1201ARCP, TLK1201AIRCP

ETHERNET TRANSCEIVERS

SLLS580D – FEBRUARY 2004 – REVISED SEPTEMBER 2007

over operating free-air temperature range (unless otherwise noted)

TLK1201A/TLK1201AI

Supply voltage, VDD (see

(2))

–0.3 V to 3 V

Input voltage range at TTL terminals, VI

–0.5 V to 4 V

Input voltage range at any other terminal

–0.3 V to VDD +0.3 V

Storage temperature, Tstg

–65

°C to 150°C

Electrostatic discharge

CDM: 1 kV, HBM:2 kV

TLK1201A

°C to 70°C

Characterized free-air operating temperature range

TLK1201AI

–40

°C to 85°C

(1)

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.

TA ≤ 25°C

OPERATING FACTOR(1)

TA = 70°C

PACKAGE

POWER RATING

ABOVE TA = 25°C

POWER RATING

RCP64(2)

5.25 W

46.58 mW/

°C

2.89 W

RCP64(3)

3.17 W

23.70 mW/

°C

1.74 W

RCP64(4)

2.01 W

13.19 mW/

°C

1.11 W

(1)

This is the inverse of the traditional junction-to-ambient thermal resistance (RΘJA).

(2)

2 oz. Trace and copper pad with solder

(3)

2 oz. Trace and copper pad without solder

(4)

Standard JEDEC high-K board

Thermal Characteristics

PARAMETER

TEST CONDITION

MIN

TYP

MAX

UNIT

Board-mounted, no air flow, high conductivity TI

recommended test board, chip soldered or greased to

21.47

thermal land

Junction-to-free-air thermal

RΘJA

Board-mounted, no air flow, high conductivity TI

°C/W

resistance

recommended test board with thermal land but no solder or

42.2

grease thermal connection to thermal land

Board-mounted, no air flow, JEDEC test board

75.83

Board-mounted, no air flow, high conductivity TI

recommended test board, chip soldered or greased to

0.38

thermal land

Junction-to-case-thermal

RΘJC

Board-mounted, no air flow, high conductivity TI

°C/W

resistance

recommended test board with thermal land but no solder or

0.38

grease thermal connection to thermal land

Board-mounted, no air flow, JEDEC test board

7.8

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