SN65DP149 datasheet(7/54 Pages) TI1

7 / 54 page

SN65DP149, SN75DP149

www.ti.com

SLLSEL2C – SEPTEMBER 2015 – REVISED JULY 2016

Product Folder Links: SN65DP149 SN75DP149

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(1)

These values are based upon a microcontroller driving the control pins. The pullup/pulldown/floating resistor configuration will set the

internal bias to the proper voltage level which will not match the values shown here.

(2)

This value is based upon a microcontroller driving the OE pin. A passive reset circuit using an external capacitor and the internal pullup

resistor will set OE pin properly, but may have a different value than shown due to internal biasing.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

GENERAL PARAMETERS

VCC

Supply voltage

3.3

3.6

VDD

1.00

1.1

1.27

TCASE

Case temperature for RSB package

93.5

°C

Operating free-air temperature

SN75DP149

°C

SN65DP149

–40

MAIN LINK DIFFERENTIAL PINS

VID_PP

Peak-to-peak input differential voltage

1200

VIC

Input common mode voltage

CAC

AC coupling capacitance

100

200

Data rate

0.25

Gbps

Vsadj

TMDS-compliant swing voltage bias resistor

6.5

kΩ

CONTROL PINS

VI-DC

DC input voltage

–0.3

3.6

VIL

(1)

Low-level input voltage at OE

0.8

Low-level input voltage at SLEW_CTL, PRE_SEL, EQ_SEL/A0, SWAP/POL

0.3

VIM

(1)

No connect input voltage at SLEW_CTL, PRE_SEL, EQ_SEL/A0, SWAP/POL

1.2

1.4

VIH

(1)

High-level input voltage at SLEW_CTL, OE(2) , PRE_SEL, EQ_SEL/A0, SWAP/POL

2.6

VOL

Low-level output voltage

0.4

VOH

High-level output voltage

2.4

IIH

High-level input current

–30

µA

IIL

Low-level input current

–10

µA

IOS

Short circuit output current

–50

IOZ

High impedance output current

µA

ROEPU

Pullup resistance on OE pin

150

250

kΩ

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

Test conditions for ΨJB and ΨJT are clarified in TI document Semiconductor and IC Package Thermal Metrics.

7.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)

THERMAL METRIC(1)

SNx5DP149

UNIT

RSB (WQFN)

40 PINS

RθJA

Junction-to-ambient thermal resistance

37.3

°C/W

RθJB

Junction-to-board thermal resistance (High-K board(2))

9.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance (High-K board(2))

23.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

3.2

°C/W

ψJT

Junction-to-top characterization parameter

0.3

°C/W

ψJB

Junction-to-case (bottom) thermal resistance

3.2

°C/W

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