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LM317S/NOPB bảng dữ liệu(PDF) 31 Page - Texas Instruments

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tên linh kiện LM317S/NOPB
Giải thích chi tiết về linh kiện  Wide Temperature Three-Pin Adjustable Regulator
PDF  48 Pages
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LM317S/NOPB bảng dữ liệu(HTML) 31 Page - Texas Instruments

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LM117, LM317-N
www.ti.com
SNVS774P – MAY 2004 – REVISED OCTOBER 2015
Thermal Considerations (continued)
Figure 42. Maximum Power Dissipation vs TAMB for the TO-263 Package
11.3.2.3 Heatsinking the TO-252 (NDP) Package
If the maximum allowable value for
θJA is found to be ≥ 54°C/W (typical rated value) for the TO-252 package, no
heatsink is needed because the package alone will dissipate enough heat to satisfy these requirements. If the
calculated value for
θJA falls below these limits, a heatsink is required.
As a design aid, Table 2 shows the value of the
θJA of NDP the package for different heatsink area. The copper
patterns that we used to measure these
θJAs are shown in Figure 47. Figure 43 reflects the same test results as
what are in Table 2.
Figure 44 shows the maximum allowable power dissipation versus ambient temperature for the TO-252 device.
Figure 45 shows the maximum allowable power dissipation versus copper area (in2) for the TO-252 device. See
AN-1028 (SNVA036) for thermal enhancement techniques to be used with SOT-223 and TO-252 packages.
Copyright © 2004–2015, Texas Instruments Incorporated
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