LM317SSLASHNOPB datasheet(30/48 Pages) TI1

tên linh kiện	LM317S/NOPB

Giải thích chi tiết về linh kiện	Wide Temperature Three-Pin Adjustable Regulator

PDF	48 Pages

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30 / 48 page

LM117, LM317-N

SNVS774P – MAY 2004 – REVISED OCTOBER 2015

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Thermal Considerations (continued)

Figure 40. Maximum Power Dissipation vs TAMB for the

Figure 39.

θJA vs Copper (2-oz.) Area for the SOT-223

SOT-223 Package

Package

11.3.2.2 Heatsinking the TO-263 (KTT) Package

Figure 41 shows for the TO-263 the measured values of

θJA for different copper area sizes using a typical PCB

with 1-oz. copper and no solder mask over the copper area used for heatsinking.

As shown in Figure 41, increasing the copper area beyond 1 square inch produces very little improvement. It

must also be observed that the minimum value of

θJA for the TO-263 package mounted to a PCB is 32°C/W.

Figure 41.

θJA vs Copper (1-oz.) Area for the TO-263 Package

As a design aid, Figure 42 shows the maximum allowable power dissipation compared to ambient temperature

for the TO-263 device (assuming

θJA is 35°C/W and the maximum junction temperature is 125°C).

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LM317S/NOPB bảng dữ liệu(PDF) 30 Page - Texas Instruments